Cadence Allegro

About this assessment

This assessment is designed for professionals and enthusiasts looking to elevate their printed circuit board (PCB) design skills. It offers a comprehensive review of critical areas including design rules, net classes, and component placement, ensuring a robust foundation for effective layout planning. Participants will explore advanced routing techniques and gain insights into signal integrity and high-speed design challenges, equipping them to manage complex electrical performance issues. Additionally, the assessment covers vital verification and analysis methods, as well as practical manufacturing preparation using Cadence Allegro. Whether you’re refining your existing expertise or transitioning into a specialized role in PCB design, this assessment provides clear, actionable insights and industry-relevant skills to help you excel in the competitive landscape.

This section explores advanced topics in Cadence Allegro PCB Design by testing knowledge on defining design rules and constraints including clearance, trace width, via sizes, and layer stack-up, as well as organizing net classes and optimizing component placements for signal integrity, manufacturability, and thermal performance.

This section will test your understanding of various routing techniques in Cadence Alegro including manual routing for controlled impedance, auto-routing followed by manual refinement, differential pair routing for high-speed signals, length matching with timing constraint considerations, and power & ground routing using polygon pours and planes.

This section covers impedance control through stack-up and material selection, crosstalk and EMI mitigation strategies, various via types for multi-layer designs, and high-frequency design techniques such as microstrip, stripline, and return path control.

This section tests your knowledge on design rule checking with respect to manufacturing and electrical constraints, the use of Cadence Sigrity for signal integrity analysis, and thermal analysis for power dissipation and heat flow.

This section covers advanced topics in Cadence Allegro related to manufacturing preparation including Gerber file generation (export of Gerber, Drill, and ODB++), panelization techniques for mass production, and assembly checks ensuring accurate alignment of footprints, silkscreen, and solder mask.