how to select the right Package Design and Development Engineer

Selecting the Right Package Design and Development Engineers

Hiring is one of the toughest challenges any company can face, either large enterprises or new startups. There is a great deal of know-how kind of experience when hiring a Package Design and Development Engineer, not all companies have the right processes that can warrant best hires.

At SupportFinity, we streamlined our processes and in-house standards to make sure of having one of the top world-class hiring processes. The magic mix of skills ingredients is what separates a great hire from a not-so-good one. We came to this conclusion through consulting top technical and HR experts in addition to our years of work and exposure with most sophisticated projects across almost all tech verticals and areas of expertise. So you get one of the best recruitment processes to hire a Package Design and Development Engineer.

As we have created and crafted a unique method of teams’ customization, we have also perfected our signature model of matching the right skills for our customers to hire either one Package Design and Development Engineer or a team of Package Design and Development Engineers. We have a long lasting belief in the power of data analytics in creating unmatchable results, thus, we apply our analytical models on our hiring process same as we do in our business model.

Package Design and Development Engineer Job Description Template

Package Design and Development Engineer

AKA: IC Design Engineer


Responsibilities
  • The Package Design and Development Engineer works with cross-functional teams to define and development package solution for high electrical performance, high power and large pin count device.
  • Setups package design rules and implements in-house packaging layout to meet all requirements for product.
  • Packages model extraction for SI/PI model.
  • The Package Designs and Development Engineer collaborates with foundry, PE, TE and QA teams to complete product bring up and qualification.
  • Interfaces with external foundry / assembly / substrate suppliers on process optimization, materials characterization and failure analysis from product design concept to mass production.
  • Designs for manufacturability and designs for reliability.
  • Drives suppliers on Design of Experiment and data analysis for assembly process and packaging new technology development.
  • The Package Design and Development Engineer executes or oversees the generation of drawings and specifications for new packaging designs.

Qualifications
  • Proven design experience on very large form factor flip chip package with high substrate layer count from design concept, feasibility layout to final DRC / LVS checking.
  • Strong capability and understanding to drive package roadmap to make a development successful.
  • Extensive knowledge and experience on 2.5D heterogeneous integration package material and process.
  • Experience and working knowledge of packaging mechanical and thermal issues.
  • Additional knowledge of Icepak or Flotherm is beneficial.
  • Deep understanding of Voltage Regulator design principles and electrical performance is a plus.
  • Experience using Cadence Virtuoso is a plus.
  • Knowledge of high-speed IO interfaces including DDR/PCIE/Ethernet.

How It Works?

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3

Skills Matrix at SupportFinity

These are sets of the must have skills that we care about and put as top requirements needed for hiring first class Package Design and Development Engineer.

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